Awọn ohun elo: SECC, SPCC, SGCC, SPHC,
irin ti ko njepata,Ejò,Idẹ,
idẹ, phosphor Ejò, beryllium Ejò,
tinplate, Aluminiomu ati be be lo.
Ṣiṣẹ diẹ sii: Punching, titẹ ni kia kia, atunse, riveting, alurinmorin, lilọ, Die/Mould Development ati be be lo
Ifarada: 0.01mm
Itọju Ilẹ: Fọ, didan, Electrophoresis, Anodized, Coating Powder, Plating, Silk screen, Laser Engraving etc.
Akoko asiwaju: Da lori iyaworan onibara ati ibeere
Eto QC: Ayẹwo kikun ṣaaju gbigbe fun gbogbo sisẹ
Iṣakojọpọ: 1) package Standard
2) Pallet tabi eiyan
3) Gẹgẹbi awọn alaye ti a ṣe adani
Awọn ofin sisan: T/T, L/C
Awọn ofin gbigbe: 1) 0-100kg: kiakia & ayo ẹru afẹfẹ
2)> 100kg: ayo ẹru okun
3) Gẹgẹbi awọn alaye ti a ṣe adani
Iṣẹ Iduro Kan: Die/Mould idagbasoke-Afọwọṣe-Igbejade-Iyewo-Itọju Idaju-Packing-Ifijiṣẹ